Avicena Ships World's First 1Tbps Evaluation Kits, Extending Its Leadership in microLED Optical Interconnects
Avicena, the pioneer in microLED-based optical interconnects, today announced that it has begun shipping 1 Tbps LightBundle™ evaluation kits (eKits) to customers and partners developing next-generation AI infrastructure. The shipment milestone follows the introduction and demonstration of the LightBundle eKit in March 2026 at the Optical Fiber Conference (OFC26) and advances the platform from initial evaluation availability to terabit-class operation in customer laboratories.
Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
Avicena, the pioneer in microLED-based optical interconnects, today announced the LightBundle™ eKit, the industry’s first evaluation platform for microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit enables hyperscaler, AI accelerator, high-bandwidth memory (HBM), networking, and AI infrastructure architects to evaluate next-generation optical links designed to overcome the bandwidth, reach, routing and energy limitations of copper interconnects in AI systems.
Avicena Demonstrates Breakthrough Ultra-Low Power microLED Link at 200fJ/bit Tx Power
Avicena, the leader in next-generation microLED interconnects, today announced a major milestone at ECOC 2025 with a live demonstration of a fully operational microLED-based optical link operating at an industry-leading Tx power of 200 femtojoules per bit (fJ/bit) at <1E-12 raw bit error rate (i.e. no forward error correction). This achievement highlights the efficiency of Avicena’s scalable LightBundle™ platform for high-performance computing and AI data centers.
Avicena Demonstrates 30m Reach of microLED-based LightBundle Technology at European Conference on Optical Communication
Avicena, headquartered in Sunnyvale, CA, is showcasing the world’s first microLED-based 30 meter link at ECOC 2024 in Frankfurt, Germany (https://www.ecoc2024.org/), tripling the reach shown in its previous public demonstrations. Avicena’s LightBundleTM microLED-based links provide superior bandwidth density, energy efficiency, reliability and cost compared to other optical interconnect technologies. Now, with a 30 meter reach, LightBundle interconnects can span a full row of data center racks, unlocking unparalleled performance from HPC and AI clusters.
Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA (https://www.ofcconference.org/en-us/home/). The chiplet interconnect extends ultra-high density die-to-die (D2D) connections up to 10m at multi-Tbps/mm shoreline bandwidth density and class leading sub-pJ/bit energy efficiency. Based on Avicena’s LightBundle platform which supports unprecedented shoreline density and energy efficiency, it unlocks increased performance from HPC and AI cluster architectures.
Avicena will showcase the world’s smallest 1Tbps optical transceiver at the SuperComputing Conference 2023 in Denver, CO
Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the SuperComputing Conference (SC23) in Denver, CO (https://sc23.supercomputing.org/). Avicena’s microLED-based LightBundle architecture supports unprecedented throughput, shoreline density and low power, unlocking the performance of processors, memory, and sensors.
Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023
Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2023 in Glasgow, Scotland (https://www.ecocexhibition.com/). Avicena’s microLED-based LightBundle architecture breaks new ground by unlocking the performance of processors, memory and sensors, removing key bandwidth and proximity constraints while simultaneously offering class leading energy efficiency.
Avicena Partners With ams OSRAM to Enable High-Volume Future Production of Ultra-Low Energy Chip-to-Chip Interconnects
Avicena Tech Corp., a privately held company in Sunnyvale, CA, has partnered with ams OSRAM to develop high-volume manufacturing of GaN microLED arrays for its industry-leading LightBundle™ communication architecture.
Avicena Will Showcase Its Multi-Tbps LED-Based Optical Link for Chip-to-Chip Communication at ECOC 2021
Avicena Tech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle™ multi-Tbps LED-based chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2021 in Bordeaux, France (https://www.ecocexhibition.com/).
