Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle™ interconnect platform at OFC 2025 in San Francisco, CA (https://www.ofcconference.org/en-us/home/). LightBundle supports > 1Tbps/mm shoreline density and extends ultra-high density die-to-die (D2D) connections to > 10 meters at class leading sub-pJ/bit energy efficiency. This will enable AI scale-up networks to support large clusters of GPUs across multiple racks, eliminating reach limitations of current copper interconnects while drastically reducing power consumption.
Avicena Raises $25 Million in Series A to Fund Development of High Capacity microLED-based Optical Interconnects
AvicenaTech Corp., the leader in microLED-based chip-to-chip interconnects, today announced that the company has secured $25M in Series A funding from Samsung Catalyst Fund, Cerberus Capital Management, Clear Ventures, and Micron Ventures to drive the development of products based on Avicena’s breakthrough photonic I/O solution.
